Weicon Epoxy Minute Adhesive
Semi-liquid, self-leveling | fast curing | very short open time | transparent
WEICON Epoxy Minute Adhesive bonds fibre-reinforced materials, plastics, stone, glass, wood, ceramics, metals and many other materials. It is used where a manual dispenser is not needed.
Application:
- For low energy plastics
- For composite materials
- For glass
- For ceramics
- For wood
- For composite fibers
- To the stone
-
Shelf life 18 months at +20°C in a dry, dark place
Features and Benefits:
- Resistant to temperatures up to +80°C
- Quick curing
- Transparent color
- Two-component glue
- Semi-liquid self-leveling adhesive
- short opening time
Technical data (data source TDS_10550024 pdf)
Filler | no filling |
Consistency | dense |
Color | transparent |
Operating temperature | +10°C to +30°C |
Curing temperature | +6 to +40 |
Mixture mass ratio, weight | 1:1 |
Viscosity of the mixture at +20 °C | 8,500 mPa s |
Mixture density | 1.15 g/cm³ |
Maximum gap up to | 2mm |
Open time at 20°C, portion 10 ml | 3-4 mins. |
Initial Strength (35% Strength) | 30 mins |
Mechanical strength after (50% Strength) | 1 hour |
Final Strength (100% Strength) | 24 hrs |
Contractility | 2.0% |
Tensile strength DIN EN ISO 527-2 | 40 MPa |
Modulus of elasticity DIN EN ISO 527-2 | 2,000 - 2,500 MPa |
Pressure resistance DIN EN ISO 604 | 9 MPa |
Bending strength DIN EN ISO 178 | 58 MPa |
Hardness (Shore D) DIN ISO 7619 | 65 |
Tensile shear strength depending on material thickness 1.5mm DIN EN 1465 |
|
Steel 1.0338 sandblasted | 20N/mm² |
Sandblasted aluminum | 19 N/mm² |
Hard PVC rough | 13 N/mm² |
Temperature resistance | -50°C to +80°C |
Dielectric strength DIN EN 60243-1 (20°C) | 20kV/mm |
ISSA Code | 75.629.50 |
Product number:
|
10057686 |
EAN
|
4024596078959 |
Application method:
The conditions for perfect bonding are clean and dry surfaces (cleaning and degreasing with WEICON Surface Cleaner). Smooth surfaces should be machined. WEICON Easy-Mix products can be applied directly from the double cartridge using a static mixer. Discard the first 5 cm of the adhesive. The adhesive is applied from one side. The open times given refer to a 10 ml mixture at room temperature. Larger quantities will cure faster due to the thermal reaction typical of epoxy resins. Higher temperatures shorten the curing time and the open time of the adhesive processing. (as a guide - each 10°C above room temperature shortens both times by 50%). At temperatures below +16°C the open time and the curing time are extended. From a temperature of approx. +5°C no further reaction occurs.
Safety and health
When using WEICON products, please observe the physical, safety, toxicological and ecological data and regulations in our safety data sheets (www.weicon.de)
Available packaging and accessories:
[ 50g ] [ 1set ] [ Easy-Mix D 50 Dosing Gun ] [ Nozzle ] [ Dosing tips ]
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