Weicon Easy-Mix S 50 epoxy adhesive

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Cechy szczególne: Dobra przyczepność do wielu podłoży, Klej/uszczelniacz dwuskładnikowy, Wysoka przyczepność i adhezja

Przemysł: Elektronika, Energetyczny, Fotowoltaika, Górnictwo, Konserwacja i Remonty, Konsumencki, Lotnictwo, Medycyna i farmacja, Motoryzacja, Obróbka i produkcja metali, Papier i Celuloza, Przemysł ciężki, Ropa i gaz, Sprzęt AGD, Stolarski i Drewniany, Transport

Weicon Easy-Mix S 50 epoxy adhesive

Semi-liquid / self-leveling / very short open time / fast curing / extremely high adhesion strength
WEICON Easy-Mix S 50 is used for bonding many materials such as metal, plastic, composite fibre, ceramic, glass, stone or wood. It is suitable for quick repair and maintenance work and is ideal for industrial series production with short cycle times. WEICON Easy-Mix S 50 can be used in many areas of industry.

The Easy-Mix D 50 dispensing gun is required to process Easy-Mix products in 50 ml containers.

Application:

  • For low energy plastics
  • For composite materials
  • For glass
  • For ceramics
  • For wood
  • For repair work
  • For maintenance work
  • Shelf life 18 months at +20°C in a dry, dark place
  • Shelf life 6 months if these storage instructions are not followed

Features and Benefits:

  • Resistant to high temperatures up to +80°C
  • Extremely high adhesion strength
  • Transparent color
  • Semi-liquid self-leveling adhesive
  • Quick curing
  • Very short open time
  • Two-component glue

Technical data (data source TDS_10650050 pdf)

Base Epoxy resin, unfilled
Properties dense
Color transparent
Resin/hardener mixing ratio capacity (automatic) 1:1
Viscosity of the mixture 1.15 g/cm³
Mixture viscosity at +20 °C (+68 °F) 8,500 mPa s
Maximum gap up to 2mm
Curing temperature +6 to +40 °C
Open time at +20°C portion 10 ml 4 - 5 mins.
Strength 35% after 30 mins
Transfer of mechanical load (50% strength) after 1 hour
Final strength (100%) after 24 hrs
Average resin strength DIN EN 1465
Pressure 9 Mpa
Adhesion 40 Mpa
Bending 58 Mpa
Tg room temperature 44.7°C
Tg at 90°C 46.1 °C
E-Module 2.000 - 2.500 Mpa
Shore D hardness 65
Average shear strength DIN EN 1465
sandblasted steel 20N/mm²
Sandblasted aluminum 19 N/mm²
Hard PVC rough 13 N/mm²
Linear shrinkage 2.0%
Thermal resistance -50 to +80 °C
Thermal resistance (23 °C) 0.133 mm²/s
Thermal conductivity 0.24 W/m K
Thermal Specification 1.482 J/(g K)
Characteristic properties 1.03 10^11 ohm
Product number:
10046414
EAN
4024596069858

Application method:

The conditions for perfect bonding are clean and dry surfaces (cleaning and degreasing with WEICON Surface Cleaner). Smooth surfaces should be machined. WEICON Easy-Mix products can be applied directly from the double cartridge using a static mixer. Discard the first 5 cm of the adhesive. The adhesive is applied from one side. The open times given refer to a 10 ml mixture at room temperature. Larger quantities will cure faster due to the thermal reaction typical of epoxy resins. Higher temperatures shorten the curing time and the open time of the adhesive processing. (as a guide - each 10°C above room temperature shortens both times by 50%). At temperatures below +16°C the open time and the curing time are extended. From a temperature of approx. +5°C no further reaction occurs.

Safety and health

When using WEICON products, please observe the physical, safety, toxicological and ecological data and regulations in our safety data sheets (www.weicon.de)

Available packaging and accessories:

[ 50g ] [ Easy-Mix D 50 Dosing Gun ] [ Nozzle ] [ Dosing tips ]

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