Features and benefits:

• single-component
  
• not flowing
• does not require heating or hardening
• increases reliability by flowing heat away from electrical circuit components

Benefits of use

System assemblies are continually designed to provide higher performance.
Especially in the area of ​​consumer devices, there is also a continuing trend towards smaller, more compact designs. The combination of these factors usually means that more heat is generated in the device. Managing the temperature of PCB system assemblies is a primary concern for design engineers.

A cooler device allows for more efficient operation and better reliability throughout the life of the device. As such, heat-conducting compounds play an integral role here.

Thermally conductive materials act as a thermal "bridge" removing heat from the heat source (device) to the surroundings via the heat carrier (i.e. heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve a thin bond line thickness (BLT), which can help improve heat transfer away from the device.