DOWSIL 340 Heat Sink Compound - Thermal conductive paste

84,63 zl PLN 89,08 zl PLN Save 4,45 zl PLN

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Atest: NSF H1 spożywczy do kontaktu z żywnością

Cechy szczególne: Dobra przyczepność do wielu podłoży, Dobra wytrzymałość dielektryczna, Klej/uszczelniacz jednoskładnikowy, Utwardzanie Acetoxy (Octowy)

Niska temperatura: mniej niż -50°C

Norma: FDA 177.2600, MIL-A-46106

Pojemność opakowania: 310ml

Przemysł: Sprzęt AGD,

Wysoka temperatura: +151°C do 200°C

Zastosowanie: Wielozadaniowe

DOWSIL™ 340 Heat Sink Compound

Thermal paste White, non-flowing, thick mixture with good thermal conductivity


Designed for thermal connection of electrical devices and PCB assemblies with radiators

Application:

  • Radiators
  • processors and electronic systems
  • PCB assemblies
  • aviation
  • starting and charging batteries
  • boards and components
  • connectors, wiring harnesses
  • thermal paste for cold stores

Features and benefits:

  • single-component
  • not flowing
  • does not require heating or hardening
  • increases reliability by moving heat away from electrical circuit components

Benefits of using

System components are continually designed for higher performance.
Especially in the consumer device space, there is also a continuing trend toward smaller, more compact designs. The combination of these factors usually means that more heat is generated in the device. Thermal management of PCB system assemblies is a primary concern for design engineers.

A cooler unit allows for more efficient operation and improved reliability throughout the life of the unit. As such, heat transfer compounds play an integral role here.

Thermally conductive materials act as a thermal "bridge" removing heat from the heat source (device) to the environment via a heat transfer medium (i.e., heat sink). These materials have properties such as low thermal resistance, high thermal conductivity, and can achieve a thin bond line thickness (BLT), which can help improve heat transfer away from the device.

Basic parameters

Dowsil 340 Thermally Conductive Compound

Parameter Unit Result
Composition Zinc oxide,
Polydimethylsiloxane
Single or two-component Single component
Color White
Ill-liquid Yes
Viscosity cP 542,000
Pa-sec Pa-sec 542
Density (uncured) at 25 °C 2.1
Volatility % 0.23
Thermal conductivity btu/hr-ft-°F W/mK 0.67
Thermal resistance at 40 psi °C*cm2/W 0.16
Penetration (Worked) 1/10mm 290
Evaporation % 0.38
Shelf life at 38°C months 60

Storage and durability

The product should be stored in its original packaging, tightly closed with a lid to avoid any contamination. Store in accordance with the special instructions listed in the card. Product durability 5 years from the date of production.


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